A fast electromagnetic solver for 3D integrated circuit interconnects based on volume integral equation

Metallic interconnects permit integrated circuits to communicate with each other in 3D space. Fast and accurate parameter extraction is one of the key techniques to ensure the signal integrity. In this paper, a fast electromagnetic solver combining Green functions for the planar multilayer media and the pre-corrected fast Fourier transformation (pFFT) is proposed to extract the parameters of interconnects and model the skin effect inside each conductor. Compared with the results obtained from HFSS, our solver could obtain accurate results with much less number of unknowns and 50% efficiency improvement. As a result, this solver is promising to extract the parameters of interconnects in 3D integrated circuits.