基于体积分方程的三维集成电路互连线电磁快速求解器

杨顺川; 苏东林

doi:10.13443/j.cjors.2018112101

基于体积分方程的三维集成电路互连线电磁快速求解器

A fast electromagnetic solver for 3D integrated circuit interconnects based on volume integral equation

摘要

摘要: 三维集成电路通过高密度金属互连线实现芯片在三维空间上互连，其电路参数的快速提取是保证信号完整性良好设计的关键技术之一.文中基于体积分混合势积分方程（mixed potential integral equation，MPIE）方法，结合多层平面介质格林函数与预纠正快速傅里叶变换（pre-corrected fast fourier transformation，pFFT）方法，通过对互连线内趋肤电流准确建模，实现对互连线结构S参数的快速准确提取.通过对典型互连线结构的仿真表明，本文求解器得到的结果与商业软件HFSS结果在网格剖分考虑趋肤效应时，其精度相当，计算效率可提高50%以上.所以本文方法在三维集成电路互连线参数快速提取方面具有一定的应用前景.

Abstract: Metallic interconnects permit integrated circuits to communicate with each other in 3D space. Fast and accurate parameter extraction is one of the key techniques to ensure the signal integrity. In this paper, a fast electromagnetic solver combining Green functions for the planar multilayer media and the pre-corrected fast Fourier transformation (pFFT) is proposed to extract the parameters of interconnects and model the skin effect inside each conductor. Compared with the results obtained from HFSS, our solver could obtain accurate results with much less number of unknowns and 50% efficiency improvement. As a result, this solver is promising to extract the parameters of interconnects in 3D integrated circuits.

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