基于拓扑保护的高Q值太赫兹超表面

      High-Q factor terahertz metasurface based on topological protection

      • 摘要: 本研究设计了一种拓扑保护的硅基超表面,在太赫兹(THz)频段实现拓扑保护的高品质因子(Q因子)谐振。传统THz器件长期受限于衍射极限导致的辐射损耗,其品质因子普遍低于105,严重制约了通信与传感性能。针对这一技术瓶颈,本研究基于拓扑光子学理论,提出一种具有C6v对称性的硅基超表面设计。通过构建三角形晶格光子晶体平板,在晶胞内引入圆柱型蚀刻孔实现对称性保护,并采用理想磁导体边界条件分离TE模式,将连续域束缚态(bound states in the continuum, BIC)的拓扑保护机制引入THz频段。结果显示Γ点处Q因子达到1010量级,且BIC位于远场辐射的偏振涡旋中心,验证BIC机制及其拓扑特性,仿真结果良好。最终实现Q因子较传统器件提升多个数量级,且拓扑保护机制可以显著抑制加工缺陷与环境扰动对谐振性能的影响,为低损耗通信器件、光学可编程技术与量子光源设计提供了新范式。

         

        Abstract: This study designed a topologically protected silicon-based metasurface to achieve topologically protected high-Q factor resonance in the terahertz (THz) frequency band. Traditional THz devices have long been constrained by radiation losses caused by the diffraction limit, with quality factors generally below 105, severely limiting communication and sensing performance. To address this technical bottleneck, this study proposed a silicon-based metasurface design with C6v symmetry based on the theory of topological photonics. By constructing a triangular lattice photonic crystal plate, cylindrical etched holes are introduced within the unit cell to preserve symmetry, and ideal magnetic conductor boundary conditions are employed to separate TE modes, thereby incorporating the topological protection mechanism of bound states in the continuum into the THz frequency band. The results show that the Q factor reaches 1010 at the Γ point, and the BIC is located at the center of the polarization vortex in the far-field radiation, verifying the BIC mechanism and its topological properties. The simulation results are excellent. Ultimately, the Q factor is improved by several orders of magnitude compared to traditional devices, and the topological protection mechanism can significantly suppress the impact of processing defects and environmental disturbances on resonance performance, providing a new paradigm for low-loss communication devices, optical programmable technology, and quantum light source design.

         

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