Abstract: Electronic systems exposed to high power microwaves(HPM) may experience multiphysics coupling effects that can lead to performance degradation or even damage. To guide the design of electromagnetic protection, it is necessary to study large-scale electric (magnetic)-thermal-stress coupling parallel simulation methods. By integrating high-performance parallel computing frameworks and domain decomposition methods, efficient numerical simulations of ultra-large-scale complex structures can be achieved. In the numerical simulation of electrical-thermal-mechanical coupling in passive structures, the current continuity equation, the heat conduction equation, and the thermal stress equation need to be repeatedly solved at each time step, with coupling between fields achieved through Joule heating and temperature-dependent material parameters. Once steady-state is reached, the simulation proceeds to the next time step. In the numerical simulation of electromagnetic-thermal-stress coupling processes in RF passive structures, the electromagnetic field and thermal field are solved separately at each time step, and coupling is achieved through dissipated power and temperature-dependent material parameters. Once steady-state is reached, thermal stress is calculated based on the temperature rise, and then the simulation proceeds to the next time step. This paper reviews the implementation methods of large-scale parallel simulations of electric (magnetic)-thermal-stress coupling and lists the landmark achievements of domestic and international research teams in multiphysics simulations of various complex structures, such as bond wire arrays, system in package, and microwave filters.