叶鸣, 贺永宁, 崔万照. 基于电热耦合效应的微带线无源互调机理研究[J]. 电波科学学报, 2013, 28(2): 220-225.
      引用本文: 叶鸣, 贺永宁, 崔万照. 基于电热耦合效应的微带线无源互调机理研究[J]. 电波科学学报, 2013, 28(2): 220-225.
      YE Ming, HE Yongning, CUI Wanzhao. Passive intermodulation mechanism of microstrip lines based on the electrothermal coupling effect[J]. CHINESE JOURNAL OF RADIO SCIENCE, 2013, 28(2): 220-225.
      Citation: YE Ming, HE Yongning, CUI Wanzhao. Passive intermodulation mechanism of microstrip lines based on the electrothermal coupling effect[J]. CHINESE JOURNAL OF RADIO SCIENCE, 2013, 28(2): 220-225.

      基于电热耦合效应的微带线无源互调机理研究

      Passive intermodulation mechanism of microstrip lines based on the electrothermal coupling effect

      • 摘要: 给出了基于电热耦合效应确定传输线方程非线性系数的微带线无源互调(PIM)模型.考虑输入微波功率产生的焦耳热对传输线单位长度电阻参数的影响,根据电热耦合效应对金属材料电阻率的影响规律确定了单位长度电阻的非线性系数,从而在非线性传输线方程的基础上获得了微带线无源互调产生机制的物理模型.计算结果表明:微带线介质材料的热导率越大、金属材料的电阻率温度系数越小,PIM越小;在实际粗糙范围内,微带线信号线的粗糙度越小,PIM越小.理论计算结果与相关实验数据的吻合程度证实了文中模型的合理性.所得到的研究结论对低PIM微带电路设计与实现具有参考意义.

         

        Abstract: The nonlinear coefficient of the transmission line equations for passive intermodulation (PIM) model of microstrip lines was determined based on electrothermal coupling effect. Considering the fact that the distributed resistance per unit length of the transmission line can be influenced by the Joule heating effect from input microwave power, the nonlinear component of the distributed resistance was calculated through the temperature coefficient effect of metal material resistivity. Thus, a completely physic model of PIM on microstrip lines was developed. The calculation results of the model demonstrate that the PIM level increases with the increasing temperature coefficients of resistivity of metal material while decreases with increasing thermal conductivity of dielectric material. In addition, in a practical roughness condition, the PIM level increases with increasing roughness of the strip. The presented physical model can explain the related published experimental work rationally. The theoretical results can be applied to design and fabricate low PIM microstrip circuits.

         

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